PCI Pecitape Silent 20 m

PCI Pecitape Silent Self-Adhesive Edge Insulation Strip to Prevent Sound Bridges

Application Areas

• For interior use
• On raw concrete structures, floating screeds or screeds on separating layers, wooden planks, and chipboard structures, old ceramics, and natural stone structures
• For the connection area between floor and wall to prevent sound bridges during the processing of liquid floor leveling compounds such as PCI Periplan, PCI Periplan Fein, from stable fillers, as well as tile adhesives such as PCI Flexmörtel, PCI Nanolight, PCI Nanoflott Light, or parquet and covering adhesives on all suitable substrates
• To prevent three-sided adhesion in elastic edge joints
• Especially during renovation work

Product Properties

• Non-degradable polyethylene foam strip
• Self-adhesive, ensuring easy and secure processing
• High adhesion on clean substrates
• Prevents sound bridges by acting as a placeholder; leveling and laying mortars cannot penetrate the edge joint
• Very low emissions PLUS GEVEMICODE EC 1 PLUS

Material Basis

Vlies-coated polyethylene foam strip, one-sided self-adhesive with cover foil on the adhesive side, color orange, thickness 5 mm, total height of the edge insulation strip, self-adhesive zone 905040 mm

Substrate Preparation

• Carefully clean the surface to be treated, removing contaminants or rough unevenness in the transition area between wall and floor
• Depending on the material base, prime the cleaned, dry surface with an appropriate PCI primer according to the respective technical data sheet
• Allow the primer to dry

Processing

• Remove PCI Pecitape Silent from the carton and unroll the required length
• Peel off the protective foil from the adhesive film of the free fleece area and press PCI Pecitape Silent without tension onto the clean floor surface with firm pressure
• Ensure careful placement of the strip in the corner area
• At interior and exterior corners, the edge insulation strip must be flush butted and overlapped with tape, e.g., Tesa Krepp
• Immediately after, the application of liquid floor leveling compounds, stable fillers, and the laying of tiles or other coverings can be carried out